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COMPUTER NEWS & TRENDS |
In search of reliability and performance - Memory module update
 Data has to be transferred immediately, but it also has to be done accurately. Businesses want reliability on all levels a panacea for data glitches, data inaccuracies, and system crashes.
Each server type needs memory modules with the right combination of density, speed, bandwidth, form factor, and height. Dragonking Technology (www. dragonking.com.tw) is now offering energy-efficient, 1Gb-based, DDR2 reduced chip count modules and 1.5V DDR2 FBDIMMs for servers. The new RamEx 240-Pin DDR2 Fully Buffered DIMM DDRII 333/400 2GB registered ECC memory modules includes special circuitry for testing the accuracy of data as it passes in and out of memory.
Founded in 1995, Dragonking has been an authorized Kingston distributor in Taiwan since 1997. Through innovation and understanding of the marketing, the company researches and provides high end and high quality memory products with competitive prices, including more than 2,000 memory modules for a multitude of devices including desktops, notebook PCs, servers, workstations, etc.
Dragonking is headquartered in Taipei Taiwan, and also maintain branches in Beijing, Shanghai and Shenzhen.
Kingston PC3-12800 DIMMs
Kingston Technology Company has announced the launch of 1600MHz HyperX® DDR3 mid-range memory for gamers and mainstream users alike. Now shipping in 1GB and 2GB modules and 2GB and 4GB memory kits, the new HyperX modules bring the latest in DDR3 memory technology to more system builders and developers at economic price points.
“With more new chipsets able to take advantage of DDR3 memory, the time was right for Kingston to release 1600MHz modules to fill the need for an economic alternative to higher priced 1600MHz modules on the market,” said Dara Sun, strategic alliance manager, Kingston. “Our goal with this new offering is to meet the demand for a more mainstream performing DDR3 product while complementing our high frequency top-performing memory technology.’
The latest entry in its DDR3 family of next-generation enthusiast memory, Kingston’s 1600MHz DDR3 modules deliver optimum performance when paired with the latest DDR3 chipsets.
Kingston released HyperX 1375MHz DDR3 during Computex 2007, followed by 1800MHz and low-latency 1625MHz DDR3 memory in October 2007.
Kingston also makes DDR3 solutions that are Intel XMP and NVIDIA SLI certified and will soon debut HyperX SO-DIMMs for notebook systems.
KINGMAX DDR3 1066
KINGMAX has announced the SO-DIMM DDR3 1066, over-clocking DRAM.
After first launching Long-DIMM DDR3 1066 for desktop on May 2007, KINGMAX kept on introducing the best product for laptop with SO-DIMM DDR3 1066 to meet the needs of professional users. KINGMAX SO-DIMM DDR3 1066 has two capacities, 1GB /2GB for choosing.
 In order to provide the best performance, KINGMAX SO-DIMM DDR3 1066 is designed with 8-bit Pre-fetch, which meets the DDR3 standard of JEDEC ( Joint Electronic Device Engineering Council ) and packaged by CSP (Chip Scale Package; or FBGA) technology. It is a multifold improvement over the DDR2 4-bit architecture, with clocking in the 1066MHz~1600MHz range . Besides, KINGMAX SO-DIMM DDR3 1066 adopts the most popular Elpida chip to ensure the high performance in normal usage and over-clocking.
Not only speed but also stability considering, KINGMAX SO-DIMM DDR3 1066 features new functions, such as CWD, power-saving reset, ZQ calibration, SRT and PASR. All these new technologies enable the DDR3 memory to more effectively read/write data and save more energy. The working voltage is 1.5V only, compared with 1.8V of DDR2; it has approximately 17% less power consumption.
KINGMAX is the world’s first memory module maker with its own advanced packaging and testing equipment, completing a vertically integrated supply chain, i.e. every step after purchase----from chip cutting, testing, packaging to finished product testing, is independently completed at KINGMAX’s own packaging plant.
In addition, KINGMAX has continuously striven to develop a lead-free manufacturing process. Its high-quality eco-friendly lead-free DDR3 memory modules fully meet RoHS criteria, as well as environmental requirements in the United States, Japan and China, while also ensuring product performance.
With years of experience in semiconductor packaging, KINGMAX has technical manufacturing capabilities well beyond rival memory makers worldwide. In fact, the advent of the DDR3 era presents an ideal opportunity for KINGMAX to demonstrate its full potential. We have greatest confidence in our ability to provide consumers with the best memory products available.
Strengthened by its proprietary patented PIP semiconductor packaging technology and its vertical integration advantage, Kingmax is once again pushing the technology envelope with the launch of the 8GB Super Stick L series. Using advanced Micron 72-nm flash memory, up to 8GB capacity is squeezed into an ultra-tiny form-factor, resulting in the world’s smallest, highest-capacity flash drive. KINGMAX offers bubble package at no extra cost.
Transcend adds to aXeRam
Transcend, an industry leader in high quality memory modules, released a new addition to its successful aXeRam family: a DDR2-1200+ 2GB Dual-Channel Overclocking Kit with custom aluminum heat sinks. Like its DDR2-1066+ and DDR2-800+ siblings in the aXeRam line, DDR2-1200 aXeRam memory uses premium quality DRAM chips and offers unrivaled performance. While other brands of DDR2-1200 memory require 2.3V, 2.4V or even higher voltages, aXeRam achieves 1200MHz speed at just 2.2V. Lower voltage, brand-name Micron- chips, and aXeRam’s new vertical-fin heat sinks allow for much cooler temperatures and deliver superior overclocking performance while maintaining rock-solid system stability.
Designed with gamers and power users in mind, Transcend’s 2GB DDR2-1200 + aXeRam Dual-Channel Overclocking Memory Kit includes a matching pair of speed-tested and verified 1GB DDR2 1200MHz (PC2 9600) modules with all-new high performance polished aluminum heat sinks.
 To ensure compatibility, all aXeRam modules use robust six-layer PCBs that fully comply with JEDEC (the Joint Electron Device Engineering Council) standards.
The 240-pin DIMMs included in the kit are each made of 16, top-of-the-line Micron D9 series 64Mx8 chips, which are well known for their exceptional overclocking performance.
Each chip is handpicked to meet strict performance and quality requirements, and is manufactured using Fine-Pitch Ball Grid Array (FBGA) packages to assure better thermal dissipation and electrical efficiency.
Transcend’s aXeRam DDR2-1200+ memory also includes Enhanced Performance Profiles (EPP), a time-saving feature which allows users to automatically configure EPP-enabled motherboards with aggressive memory settings for better memory and system performance.
Transcend’s 2GB DDR2-1200+ aXeRam Overclocking Kit’s two identically matched 1GB modules offer incredible dual-channel speed, with memory bandwidth up to 19.2 GB/s.
This equates to a performance increase of 60 percent compared to DDR2-800 which only manages 12.8 GB/s in dual-channel mode.
System modders and enthusiasts will appreciate the distinctive styling of the included custom aluminum heat sinks with vertical fins to increase surface area and offer superior heat dissipation characteristics.
Whether playing intense 3D games or stressing your system with heavy-duty software applications, Transcend’s aXeRam 2GB DDR2-1200+ Dual-Channel Overclocking memory kit will give you the extra power you need, especially with Windows Vista.
Transcend’s memory modules are built to the highest specifications with the finest chips and materials available, and they undergo strenuous laboratory testing to ensure they provide the highest level of performance.
All Transcend memory modules come with a lifetime warranty and the support of a global service network.
They are recognized worldwide for their reliable high quality, outstanding performance, excellent compatibility, and stable operation. |
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