Advantest Corporation today announced its new T5503 high-throughput memory test system, boasting the industry's highest parallel test capability of up to 128 devices. The T5503 was developed specifically to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM memory. The memory tester will be available from August 2008 and will also be on display at the Advantest Tour de Force 2008 exhibition to be held at the Tokyo International Forum, June 3-5.
As computers become more and more sophisticated, DRAM, used largely as the main memory storage in computers, is continually being replaced with new generations of products that have ever increasing capabilities. The race to achieve higher device speeds and multiple functionality is rapidly advancing in high-performance PCs as the demand for lifelike graphics with audiovisual equipment, including digital TVs and game consoles, continues to escalate. Consequently, these and other machines are driving a shift toward increased employment of very high-speed memory devices, such as DDR3-SDRAM.
Next-generation DDR3-SDRAM boasts low power consumption through a reduced operating voltage of 1.5V, compared to the DDR2-SDRAM's 1.8V, as well as higher speed and higher volume data processing. Because of these generational advantages, manufacturers are transitioning to DDR3-SDRAM, and it is predicted to be in high demand in a wide variety of fields, ranging from high-end desktop computers to notebook computers and digital consumer electronics. As a result, price competition between IC manufacturers is predicted to escalate, driving an increased demand for volume-production solutions that deliver lower overall cost-of-test.
The T5503 enables package test of up to 128 DDR3-SDRAM devices simultaneously. This is double that of the company's previous models, enabling a major reduction in test costs for high volume production lines. Furthermore, with maximum test speeds of 3.2Gbps and data transmission speeds of over 1Gbps, it is the fastest in the industry, making it an ideal solution for high-volume production testing of DDR3-SDRAM, as well as for GDDR3 and GDDR4.
The tester's semiconductor circuitry makes full use of the latest CMOS technology to achieve greater packaging density, reducing the footprint by approximately 40% over the previous model, and leading to space savings in high-volume production lines. Power consumption has also been reduced by approximately 45% compared to the system's predecessor, enabling environmentally friendly operation. More information is available at www.advantest.com. |
